Recent Insight
We are proud to share our latest research, which has uncovered several key insights that provide a new perspective on the current state and future trajectory of the market.
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Strong iPhone 17 Demand and Component Lead Time Delays Drive Rare Seasonal Reversal in 2026 Shipments
In our latest industry analysis, we explore a rare seasonal reversal in 2026 iPhone shipments. Driven by extended component lead times and robust iPhone 17 demand, we project Q2 shipments will uniquely surpass Q1 and potentially Q3. Forecasting 1H26 production at 120–122 million units, we believe this disrupted seasonality optimizes supply chain utilization.
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Hybrid Bonding Technology Enters the Sub-Micron Era: A Co-Optimization Analysis of SiCN Material Upgrades, CMP, and Lithography Processes
With the continuous evolution of Advanced Packaging and heterogeneous integration technologies, Hybrid Bonding has become a critical pathway to break through I/O density limits and extend Moore's Law. According to observations by the Isaiah Research team, to achieve even smaller contact pitches (such as 400 nanometers or below), the industry is undergoing a comprehensive upgrade ranging from foundational materials to process equipment. Among these, the introduction of Silicon Carbonitride (SiCN) as a novel bonding dielectric material, alongside the co-optimization of Chemical Mechanical Planarization (CMP) and lithography overlay (LIT OVL error) technologies, will be core to determining the yield of future 3D ICs. This report synthesizes industry technological dynamics to deeply explore the profound impacts this technological turning point may bring to the semiconductor supply chain.
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2026 Global Smartphone Market and Chinese Brand Supply Chain Trend Forecast
Looking back at global smartphone market shipments in recent years, 2023 bottomed out at 1.134 billion units, reached 1.181 billion units in 2024, and climbed to 1.22 billion units in 2025. However, entering 2026, the market faces severe challenges. Current estimates suggest shipments will drop significantly to 1.05 billion units, representing a steep year-over-year (YoY) decline of 13.9%. Some pessimistic forecasts even project the total volume could plunge to 900 million units. Despite the severe recession in the broader market, a significant polarization in global competition has emerged. Apple and Samsung are expected to buck the trend and deliver YoY growth this year. Their growth momentum primarily stems from the across-the-board decline of Chinese brands, allowing Apple and Samsung to harvest market share globally. Therefore, the extreme cost-reduction strategies and the supply chain "downgrading" trends discussed in this report primarily focus on an in-depth analysis of the survival rules for **Chinese brands** caught in this double squeeze.
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AI Computing Ignites "Chipflation": 2026 HBM Supply-Demand Structure and Memory Market Landscape Forecast
With the comprehensive explosion of artificial intelligence applications, AI computing demand is devouring massive memory resources like a black hole, triggering a chain reaction of "Chipflation" across the semiconductor supply chain. According to supply chain checks and manufacturer data, our research team estimates that the total shipment volume of High Bandwidth Memory (HBM) is expected to experience staggering, explosive growth, surging from approximately 2.9 BGb (Billion Gigabit) in 2023 to a scale exceeding 34.3 BGb by 2026. Against the backdrop of multiple structural constraints within the supply chain—including tight wafer supply, limited cleanroom space, extended lead times for EUV lithography equipment, and bottlenecked advanced packaging capacities—it is currently observed that the tight memory supply situation may persist for several quarters or perhaps even years. This report analyzes the total HBM shipment growth in 2026, the shifting market shares among the top three memory manufacturers, and the consumption volumes and specification evolutions of major AI chip clients.
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Exclusive: After US curbs, Tencent and small chip designers chase Nvidia's China crown
Should Chinese chip designers win orders, they could still struggle for production capacity given constraints U.S. curbs put on foundries such as TSMC (2330.TW) from working with Chinese firms, said Isaiah Research Vice President Lucy Chen.
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How TSMC and other firms making the most advanced semiconductors are getting a reprieve from Biden’s chip war on China
The waiver is “good news” for TSMC, as it allows the company to continue with expansion plans for its 28-nanometer chips in Nanjing, China, says Lucy Chen, vice president of Isaiah Research, a Taiwan-based tech-research firm.
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China’s Apple loss is India’s gain, as 2022 supplier list shows shift in supply chain preferences
Apple added five new mainland Chinese suppliers while removing eight in mainland China in its latest financial year ended September 2022, after China’s strict Covid-19 controls disrupted iPhone production last holiday season, according to the latest supplier list published by the US consumer electronics giant.
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The next iPhone will still be made in China, but Apple’s main assembler Foxconn will have to share the work, report says
Foxconn may lose some iPhone 15 work to other Chinese manufacturers after it failed to deliver iPhone 14s last November due to Covid disruptions. New arrangement marks the first time Apple has tapped three suppliers to produce premium iPhones, highlighting efforts to smooth the supply chain
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