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Recent Insight

We are proud to share our latest research, which has uncovered several key insights that provide a new perspective on the current state and future trajectory of the market.

  • UMC 22/28nm productivity remains positive with respect to steady demands.

    UMC intends to maintain its expansion plan on 22/28nm capacity to meet the long-term demands of various applications, such as Automotive and ISP, by increasing overall capacity, primarily at Fab 12A in Tainan.

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  • Apple Supply Chain and Product Overview | March 2023

    The iPhone sales in Mainland China have slightly increased due to price discounts, leading us to revise our estimation from 52~57M to 53~58M in 1Q23. However, we remain conservative for the iPhone production forecast in 2Q23 as we haven’t seen a strong demand recovery. We preliminary expect the iPhone 15 series production in Y2023 may be in the range of 85~90M, with 40% low-end and 60% high-end models in the product mix.

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  • Foundry Business and Market Trend Report | March 2023

    TSMC is expected to continue transferring foundry capacities from 4/5nm to 3nm in Tainan Fab 18 due to slower wafer demand for the former and increased migration to the latter. In anticipation of strong wafer demand in the coming years, particularly from major clients like Apple, Qualcomm, MediaTek, and AMD, TSMC's 3nm capacities are projected to reach 50-60K/m in Y2023 and 90-100K/m in Y2024.

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  • Apple may target to gradually change iPhone panel notch design from pill-shaped to single-hole in Y2027.

    The three-stage migration plan, aimed at improving the Face-ID system and achieving a full-screen display, includes transitioning from a pill-shaped design(infrared camera and proximity sensor integrated with flood illuminator and dot projector) in Y2023 to a double-hole design in Y2025, and finally to a single-hole design in Y2027.

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Newscenter

Explore and access our press releases, media coverage, as well as insights from our experts on a wide range of tech topics.

  • Japan to restrict semiconductor equipment exports as China chip war intensifies

    Japan plans to impose export restrictions on 23 types of equipment used to make semiconductors, following similar curbs by the US designed to restrict China’s access to cutting-edge chips in an intensifying battle over the technology.

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  • Apple in talks with suppliers to make MacBooks in Thailand

    TAIPEI -- Apple is in talks with suppliers to make MacBooks in Thailand as the company continues to expand its manufacturing footprint outside of China amid geopolitical uncertainties.

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  • The next iPhone will still be made in China, but Apple’s main assembler Foxconn will have to share the work, report says

    Foxconn may lose some iPhone 15 work to other Chinese manufacturers after it failed to deliver iPhone 14s last November due to Covid disruptions. New arrangement marks the first time Apple has tapped three suppliers to produce premium iPhones, highlighting efforts to smooth the supply chain

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  • TSMC lowers full-year outlook on weak demand, chip surplus

    TAIPEI -- Taiwan Semiconductor Manufacturing Co., the world's biggest contract chipmaker, is predicting its first full-year revenue drop since 2009 after lowering its outlook for this year due to weak demand and persistently high inventory levels.

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