Intel's 14th generation client CPU, Meteor Lake, marks the first-ever attempt by Intel to adopt chiplet sourcing from both itself and TSMC.
We check that Apple is currently in the R&D stage of its first AR (Augmented Reality) product, with a planned launch in Y2027 or later.
Inventory levels of analog integrated circuits (ICs) are normalizing, particularly in medical and consumer electronics, with a stable range of 2.0~2.5 months.
Huawei is developing three in-house CMOS sensors for its smartphones in 2024, aiming to localize its CIS supply chain.
Global VR shipments in 2023 are anticipated to decline significantly by 20% to 30% compared to the previous year, with estimated shipments in the range of 6 to 7 million units.
Sony's 2-layer pixel sensor for iPhone 15 low-end models has a yield rate of 65-75%, which is an improvement from earlier levels of 40-50%.
Since the introduction of COE (Color Filter on Encapsulation) Pi-OLED panel in Samsung in-folding smartphone in Y2021, this innovative technology has marked a significant development in the foldable smartphone market.
As Sony has terminated the contract with Huawei due to sanction concerns, we check Huawei has already piled up Sony’s sensors which can be used till 1H24.
Huawei plans to use its in-house 5G Kirin 9 series in two upcoming smartphone series: the Mate 60 and P60 Pocket.
TSMC's Fab 20 P2 construction for N2 technology faces potential delays due to uncertain customer demand and suboptimal performance.
Ｗe checked that Apple has sent RFQs to panel suppliers such as BOE, Tianma, and Visionox for the next iPhone SE generation.
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