Insights
-
- Camera
- Display
- Smartphone
- Semiconductor
Smartphone BoM Restructuring Strategies Under Memory Inflation
Key Takeaways Strategic BoM Reallocation: Memory has become a "cost black hole," with its share of the total Bill of Materials jumping from 15% to 25%. This shift is forcing brands to freeze hardware upgrades and cannibalize budgets from other components like displays and cameras to preserve margins. Divergent Defensive Maneuvers: Apple is leveraging its massive scale to force price cuts (10–15%) from non-memory suppliers to offset costs. In contrast, Android OEMs are resorting to "specification regressions," such as reverting to LCD panels and capping DRAM at 12GB, while utilizing older, cheaper flagship processors. Market Contraction via Price Hikes: Retail prices are expected to rise by RMB 100 to 400, leading to a projected 5% decline in global shipments. Chinese brands face the steepest challenge, with a potential 10% contraction as price-sensitive consumers pull back in response to higher costs and stalled innovation.
December 25, 2025Read More -
- Semiconductor
NAND Suppliers Conservative on Technology Migration and Capacity Expansion
Key Takeaways Strategic Pivot to HBM/DRAM: Major suppliers (Samsung, SK hynix, Micron) are structurally reducing NAND capacity, with 2027 levels projected to be 40% lower than the 2022 peak. Capital and fab space are being diverted to high-margin, AI-driven HBM and advanced DRAM. Supply Constraints through 2026: Despite rising AI demand, vendors remain conservative due to 2023 losses. Since significant new capacity will not arrive until after 2027, the market will face a "tight supply-demand balance" through 2026. Focus on Technology Node Transition: The industry consensus is to meet demand through technology node transitions to increase bit density (Gb/mm²) rather than blindly building new wafer fabs. This technical upgrade drives bit output growth while maintaining supply discipline.
December 19, 2025Read More -
- Semiconductor
Tesla AI6 Chip Production Marks Samsung's Largest Foundry Win with $16.5B Strategic Partnership
Key Takeaways: • Supply chain rebalancing: $16.5B Samsung deal reduces Tesla's TSMC reliance for next-generation chips while securing U.S.-based production • Architectural paradigm shift: AI6 enables vehicle-embedded Dojo capabilities, potentially eliminating training/inference hardware separation • Timeline convergence: 2028-2030 mass production aligns with Robotaxi commercialization and Cybercab platform requirements
August 07, 2025Read More -
- Semiconductor
TSMC Thermal Interface Material Evolution: From Graphite to Liquid Metal in Advanced Packaging
Key Takeaways: • Material progression strategy: Systematic evolution from graphite→indium→liquid metal aligns with increasing power densities in R100/Venice/M4/M5 Ultra generation • Process complexity amplification: Liquid metal TIM demands UV-curable dielectric coating and six-sided AOI inspection, elevating manufacturing sophistication • Supply chain verticalization: In-house TIM control provides competitive differentiation while ensuring process reliability for premium HPC customers
July 07, 2025Read More -
- Semiconductor
TSMC announced a total of $100 billion in new investments, but the technology and mass production timeline remain highly uncertain.
Background: On March 3, TSMC announced plans to increase its investment in the United States by an additional $100 billion, bringing its total commitment to $165 billion. This expanded investment plan includes the construction of three new semiconductor fabrication plants, two advanced packaging facilities, and a major research and development center. However, these investments are likely to change as Taiwan communicates with the United States.
March 04, 2025Read More -
- Smartphone
- Semiconductor
Updates on the iPhone SE4’s Production Volumes and Potential In-house IC Adoption.
The iPhone SE4 is expected to launch in 1Q25, with mass production likely beginning in November Y2024.
August 16, 2024Read More -
- Display
- Smartphone
- Semiconductor
Novatek May Tape Out RAMless OLED TDDI in 3Q24 for Xiaomi, Targeting Mass Production in 1Q25.
Xiaomi is collaborating with Novatek again to develop RAMless OLED TDDI, providing a more cost-competitive solution.
July 12, 2024Read More -
- Display
- Smartphone
The Supply Shares of LGD and BOE in the iPhone 16 Series in Y2024 Have Increased Compared to Y2023.
We check that LGD and BOE completed verification for the iPhone 16 series in Jun'24 and Jul'24. Both suppliers are on track for initial production, indicating earlier verification timelines compared to the previous year.
July 05, 2024Read More -
- Camera
- Semiconductor
SMIC May Increase Its Wafer Prices by 10% QoQ in 3Q24, Potentially Exerting Pressure on OmniVision.
OmniVision has maintained a cost-effective position in the CIS market through its collaboration with SMIC, which offers lower wafer prices, especially in Y2023.
June 28, 2024Read More -
- Semiconductor
Potential Price Hike May Happen to HHG in 3Q24.
HHG may increase its wafer prices by around 10% in 3Q24, depending on product complexity and process platform.
June 14, 2024Read More -
- AR/VR/MR/XR
By introducing more suppliers in key components, Apple may target to launch Vision Pro 2 in 4Q25 with $1,500 retail price.
Apple might position the second generation of Vision Pro to be consumer-type with a relatively more affordable retail price of $1,500. The project of Vision Pro 2 may kick off in May’24 and aims to be announced in 4Q25.
January 19, 2024Read More -
- Smartphone
We check that certain Chinese smartphone brands, such as OPPO and vivo, may cancel their launches of clamshell foldable phones in Y2024.
OPPO and vivo may be highly confirmed to suspend the release of their flip foldable models, Find N4 Flip and X Flip 2.
January 12, 2024Read More
