Xiaomi may partner with Indian assembler Dixon for smartphone assembly, potentially affecting other EMS partners like FIH, BYD, and DBG.
Bitmain's ongoing migration of its new crypto mining ASIC from 4/5nm to 3nm suggests continued robust investment in Y2024.
Longtan plant (AP3) is facing production constraints, leading to a shift in production expansion efforts to the Zhunan plant (AP6).
Due to higher costs, ultrasonic FoD (Fingerprint on Display) is mainly found in flagship models like Samsung Galaxy S, vivo iQoo, vivo X Fold, and MEIZU 20 series.
Samsung Foundry's new 4nm process (SF4) aims for long-term market share growth, promising enhanced performance, lower power usage, better yields, and higher capacity compared to its 5nm nodes.
TSMC aims to expand its 3nm wafer capacities to 50-60K/m by the end of Y2023 and 90-100K/m by the end of Y2024, driven by robust orders and market shares from key customers.
Micron is currently in the qualification process with Nvidia to potentially become a supplier of HBM3 for their H100 GPU. Notably, recent testing has demonstrated that Micron's HBM3 exhibits a performance advantage, which positions them favorably for consideration by Nvidia.
Based on our checks, Sony may debut the second generation of 1” sensor, IMX06A, in 3Q23. By migrating the logic wafer process node from 40nm to 22nm, digital power consumption was reduced while keeping the same clock frequency, and frame rate may be increased compared to IMX989.
MediaTek is set to launch its flagship chipset, Dimensity 9300 (D9300), in 4Q23, with an expected shipment of 1-1.5 million units in Y2023. OPPO and vivo are likely to adopt the D9300 chipset for their upcoming smartphone models. vivo may be the first to use it in the X100 model in 2H23, while OPPO may incorporate it into the Find X7 in 1Q24.
BOE's punch-hole verification for the iPhone 15 series may be delayed, with mass production potentially starting after Jul’23. There is a possibility of a downward revision of 25-30% for the shipment compared to the previous estimate.
Initially, the restriction impact was anticipated to be limited to server and computing devices, but there is a possibility that the restriction will also apply to smartphones sold by telecom operators.
MediaTek is considering a reduction in wafer orders from TSMC and UMC in 2H23, with potential cuts ranging from 10~15% of the originally planned capacity, which translates to 130-150K wafers from TSMC and 55-65K wafers from UMC.
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