Apple may target to gradually change iPhone panel notch design from pill-shaped to single-hole in Y2027.
May 12, 2023
Key Takeaways:
- The three-stage migration plan, aimed at improving the Face-ID system and achieving a full-screen display, includes transitioning from a pill-shaped design(infrared camera and proximity sensor integrated with flood illuminator and dot projector) in Y2023 to a double-hole design in Y2025, and finally to a single-hole design in Y2027.
- In Y2025, the panel design of the iPhone may undergo a transition to a double-punch hole configuration as a result of integrating the Rx of the Face-ID module beneath the display.
- In Y2027, there is a potential for the iPhone panel design to migrate to a single-hole setup, incorporating both the under-display Rx and Tx components of the Face-ID module.
Full insights delivered in May 5th weekly report.
The information we shared is only a short excerpt of our monthly report. If you have further interest in our research and findings, we would be happy to provide you with a more detailed and comprehensive report that includes additional insights and data points. Please contact us to access our full insights.
You may also be interested in
- SMIC May Increase Its Wafer Prices by 10% QoQ in 3Q24, Potentially Exerting Pressure on OmniVision.
- We check Huawei might have three in-house CMOS sensors in Y2023 pipeline, leveraging XMC and its own fabs.
- Although the yield rate of Sony’s 2-layer pixel sensor may still be below target, we believe the gap of supply and demand on iPhone 15 low-end models may not be significant.
- Huawei may localize CIS supply chain to OmniVision, Smartsens, and GalaxyCore in Y2024 after the termination of Sony’s contract.
- The second generation of 1” sensor, IMX06A, may debut in 3Q23 on vivo’s X100 Pro+.

