Foundry Business and Market Trend Report | June 2023
July 31, 2023
Key Takeaways:
Samsung Foundry’s GAA Process Leadership and Acceleration:
- Samsung Foundry led the first commercial GAA process tape-out.
- To speed up GAA process adoption, Samsung Foundry introduced 2nd gen 3GAP development for internal demand, primarily from LSI with less refined PDK.
CoWoS Manufacturing and Challenges:
- We expect overall CoWoS line WIP may increase by 55~60% from 2Q23 to 4Q23, bottlenecked at CoW flip-chip bonding, moldings, and grindings.
- Capacity and operational wise, resources would be channeled to chip bonding stage where key equipment, materials, supply chains (HBM, top dies), and customer requests collectively lead to the greatest bottleneck.
- Due to the increasing AI demand from Nvidia, it is anticipated that TSMC may resume the expansion of its CoWos capacity, with a target of reaching 15~20k/m by end-Y2024.
- However, TSMC may encounter challenges such as the lengthy equipment lead time of 8 ~10 months, technology migration strategies and the limited supply of HBM from Micron.
MediaTek AP shipment Forecasts in Y2023~Y2024
- Due to excessive inventory and slower digestion, MediaTek AP shipments could decline 21-24% YoY in 2023, with a slight 0-2% increase projected for 2024.

The information we shared is only a short excerpt of our monthly report. If you have further interest in our research and findings, we would be happy to provide you with a more detailed and comprehensive report that includes additional insights and data points. Please contact us to access our full insights.

