TSMC Retains Momentum in 3nm Productivity.
March 10, 2023
Key Takeaways:
- The N3E version of the 3nm process may be prioritized for mass production instead of the N3B version due to its simpler process complexity and potential cost and time savings.
- TSMC's Fab 18 in Tainan is the major facility for 3nm mass production, and it may convert its P4 capacity and equipment from 5nm to 3nm to meet client demand.
- Apple is expected to be the first customer to use TSMC's N3 technologies for its A17 SoC in the iPhone 15 and M-series processors for Mac products, with a migration from N3B to N3E expected by the end of March.
- Qualcomm and MediaTek's first application processors using N3 may enter risk production in 4Q23 and Y2024, respectively.
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Authors
Lucy Chen
Lucy Chen, Vice President at Isaiah Research, has been working 25+ years in semiconductor industry. Focus on semiconductor engineering and supply chain research. Master in Application Chemistry, NCTU, Taiwan Currently as the Vice President at Isaiah Research and lead semiconductor research team to work on the supply chain analysis from IC design and IDM(Qualcomm, MediaTek, Intel, etc) to foundries(TSMC, Samsung, UMC, GlobalFoundries, SMIC) and OSATs(ASE,SPIL). Business development and customer management including raw materials and equipment suppliers, top tier foundries and smartphone brands. Used to work as the Engineering Director at Lam Research for 15+ years and Director of Technology & Marketing at SEZ Group. Focus on process engineering, product strategies planning, supply chain and customer management including foundries and memory.
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