MediaTek may cut significant wafers from TSMC and UMC.

June 02, 2023

Key Takeaways:

 

  • MediaTek is considering a reduction in wafer orders from TSMC and UMC in 2H23, with potential cuts ranging from 10~15% of the originally planned capacity, which translates to 130-150K wafers from TSMC and 55-65K wafers from UMC.
  • The intended application for the reduction is in the field of Power Management Integrated Circuits (PMICs), and our investigation suggests that MediaTek's PMIC inventory level may currently be at approximately 8 to 10 months' worth.
  • The decision to reduce orders is driven by challenges related to inventory digestion and weakened demand for smartphones in the Chinese market.

 

Full insights are delivered in May 26th weekly report.

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Authors

Lucy Chen

Lucy Chen, Vice President at Isaiah Research, has been working 25+ years in semiconductor industry. Focus on semiconductor engineering and supply chain research. Master in Application Chemistry, NCTU, Taiwan Currently as the Vice President at Isaiah Research and lead semiconductor research team to work on the supply chain analysis from IC design and IDM(Qualcomm, MediaTek, Intel, etc) to foundries(TSMC, Samsung, UMC, GlobalFoundries, SMIC) and OSATs(ASE,SPIL). Business development and customer management including raw materials and equipment suppliers, top tier foundries and smartphone brands. Used to work as the Engineering Director at Lam Research for 15+ years and Director of Technology & Marketing at SEZ Group. Focus on process engineering, product strategies planning, supply chain and customer management including foundries and memory.

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