TSMC expands not only CoWoS-S but the emerging CoWoS-L capacity.
August 04, 2023
Key Takeaways:
- Longtan plant (AP3) is facing production constraints, leading to a shift in production expansion efforts to the Zhunan plant (AP6).
- In addition to CoWoS-S expansion, CoWoS-L expansion is underway at Zhunan plant (AP6B) for 2H24 production.
- CoWoS-L offers area scalability with RDL and silicon embedded interconnects for packaging exceeding 3~3.5x reticle size, becoming TSMC’s primary 2.5D packaging after Y2025.
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Authors
Lucy Chen
Lucy Chen, Vice President at Isaiah Research, has been working 25+ years in semiconductor industry. Focus on semiconductor engineering and supply chain research. Master in Application Chemistry, NCTU, Taiwan Currently as the Vice President at Isaiah Research and lead semiconductor research team to work on the supply chain analysis from IC design and IDM(Qualcomm, MediaTek, Intel, etc) to foundries(TSMC, Samsung, UMC, GlobalFoundries, SMIC) and OSATs(ASE,SPIL). Business development and customer management including raw materials and equipment suppliers, top tier foundries and smartphone brands. Used to work as the Engineering Director at Lam Research for 15+ years and Director of Technology & Marketing at SEZ Group. Focus on process engineering, product strategies planning, supply chain and customer management including foundries and memory.
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