Foundry Business and Market Trend Report | May 2023

June 30, 2023

Key Takeaways:


Japan Restriction on Semiconductor Equipment:

  • In May 2023, Japan announced semiconductor equipment restrictions starting in July 2023. The restricted equipment includes lithography, etching, implanting, thin film deposition, cleaning, and metrology.

TSMC 3nm Status Updates:

  • TSMC has commenced mass production of its 3nm process, with Apple as its first customer. The A- and M-series processors manufactured on the 3nm node have achieved a wafer yield of approximately 63-68% for A-series chips and around 40% for larger dies on the N3B node.
  • TSMC's N3B yield rate is expected to be around 65-70%, representing a 10-15% decrease compared to the 4/5nm nodes due to comparable defect density.

Smartphone AP Shipment Updates:

  • Regarding vendor shipments, we project a year-on-year decline of 18-21% for MediaTek AP shipments and a 15-18% drop for Qualcomm shipments in 2023. However, Hisilicon is expected to ship 9-12 million units, providing a potential bright spot in the market.
  • For Qualcomm's SDM8550, we anticipate shipments to reach 50-55 million units in 2023. Chinese smartphone OEMs are projected to procure 18-20 million units, while Samsung is expected to procure 30-35 million units in the same period.

 

Potential Alternative Vendors for Critical Process Equipment Tool:

The information we shared is only a short excerpt of our monthly report. If you have further interest in our research and findings, we would be happy to provide you with a more detailed and comprehensive report that includes additional insights and data points. Please contact us to access our full insights.

Authors

Lucy Chen

Lucy Chen, Vice President at Isaiah Research, has been working 25+ years in semiconductor industry. Focus on semiconductor engineering and supply chain research. Master in Application Chemistry, NCTU, Taiwan Currently as the Vice President at Isaiah Research and lead semiconductor research team to work on the supply chain analysis from IC design and IDM(Qualcomm, MediaTek, Intel, etc) to foundries(TSMC, Samsung, UMC, GlobalFoundries, SMIC) and OSATs(ASE,SPIL). Business development and customer management including raw materials and equipment suppliers, top tier foundries and smartphone brands. Used to work as the Engineering Director at Lam Research for 15+ years and Director of Technology & Marketing at SEZ Group. Focus on process engineering, product strategies planning, supply chain and customer management including foundries and memory.