Foundry Business and Market Trend Report ｜ October 2023
November 30, 2023
Key Takeaways:
TSMC N3 Status Updates:
- In 2023, N3B demonstrates robust collaboration with Apple, yet encounters challenges associated with reduced utilization. The N3 series, supporting both smartphones and data centers, continues to play a pivotal role in the semiconductor landscape.
Intel’s Strategic Outsourcing Details for Y2024:
- We believe Intel will fully outsource Arrow Lake CPU to TSMC 3nm in Y2024 for the first time. Preliminary estimates suggest a full-year wafer input ranging between 5~6K/m for Arrow Lake.
- For Meteor Lake, Intel outsources its GPU tiles to TSMC’s 5nm with wafer demand of 30~35K and I/O tiles, SoC tiles to 6nm with wafer demand of 160~170K in Y2024.
Analog IC Status Updates:
- We've noticed that the inventory levels of analog ICs in certain applications are gradually normalizing, implying that sustaining a healthy inventory level of 8~10 weeks is no longer a challenge.
- In terms of pricing, even though generic and application specific analogs ICs have separately declined by 15~25% and 8~12% in Y2023, the tier-1 IDMs might continue to reduce the price of their analog ICs for inventory digestion, due to their advantages of manufacturing costs.
Global AP(Application Processor) Shipments Updates:
- We revise up the global AP shipment forecast in Y2024 to 1,120~1,170mn, implying a mild increase by 4~7% YoY due to the stronger-than-expected order improvement after Huawei 5G smartphone release.
Table: Analog IC Distributors’ Days of Inventory in Oct’23 (Unit: Week)
The information we shared is only a short excerpt of our monthly report. If you have further interest in our research and findings, we would be happy to provide you with a more detailed and comprehensive report that includes additional insights and data points. Please contact us to access our full insights.
Authors
Lucy Chen
Lucy Chen, Vice President at Isaiah Research, has been working 25+ years in semiconductor industry. Focus on semiconductor engineering and supply chain research. Master in Application Chemistry, NCTU, Taiwan Currently as the Vice President at Isaiah Research and lead semiconductor research team to work on the supply chain analysis from IC design and IDM(Qualcomm, MediaTek, Intel, etc) to foundries(TSMC, Samsung, UMC, GlobalFoundries, SMIC) and OSATs(ASE,SPIL). Business development and customer management including raw materials and equipment suppliers, top tier foundries and smartphone brands. Used to work as the Engineering Director at Lam Research for 15+ years and Director of Technology & Marketing at SEZ Group. Focus on process engineering, product strategies planning, supply chain and customer management including foundries and memory.
