Foundry Business and Market Trend Report ｜ January 2023
February 14, 2023
Key Takeaways:
TSMC Arizona Fab21 Update
According to our research, we briefly updated TSMC Arizona Fab21 Schedule as below,
- P1 tool move-in has been delayed to May’23 due to prolonged clearances and import process of wafer equipment tools.
- P2 has been under construction and expected topping and tools move-in in 3Q24.
The Yield Rate Tracks of Apple’s A-series and M-series in TSMC 3nm
Apple being the first customer on 3nm has been mass producing its A-series and M-series processors with an approximate wafer yield of 63~68% for small dies, and less than 40% yield for large dies.
SiC Market Outlook (Y2023)
SiC substrates are crucial to SiC power devices adopted by high voltages applications. Both demand and supply are estimated to grow significantly in Y2023. Current SiC substrate capacity may sit around 850~870K of which most capacity is in China, followed by US, EU, and east Asia.
Smartphone AP Shipment Forecast (Y2023)
We revised down global AP shipment forecast in Y2023 by 5~10% due to the conservative procurement willingness from Chinese smartphone OEMs with the high AP inventory level.
Chinese PXW’s Fab Schedule Forecast (Y2023~Y2025)
We see PXW’s fab is currently under construction and the clean room will be ready this year. Equipment and tools may further start to move-in in 2H23. The technology nodes will first target 28nm and 40nm, expecting to mass produce 5nm with self-developed EUV after Y2025.
Full insights delivered in Jan'23 Monthly Report.
The information we shared is only a short excerpt of our monthly report. If you have further interest in our research and findings, we would be happy to provide you with a more detailed and comprehensive report that includes additional insights and data points. Please contact us to access our full insights.
Authors
Lucy Chen
Lucy Chen, Vice President at Isaiah Research, has been working 25+ years in semiconductor industry. Focus on semiconductor engineering and supply chain research. Master in Application Chemistry, NCTU, Taiwan Currently as the Vice President at Isaiah Research and lead semiconductor research team to work on the supply chain analysis from IC design and IDM(Qualcomm, MediaTek, Intel, etc) to foundries(TSMC, Samsung, UMC, GlobalFoundries, SMIC) and OSATs(ASE,SPIL). Business development and customer management including raw materials and equipment suppliers, top tier foundries and smartphone brands. Used to work as the Engineering Director at Lam Research for 15+ years and Director of Technology & Marketing at SEZ Group. Focus on process engineering, product strategies planning, supply chain and customer management including foundries and memory.
