Foundry Business and Market Trend Report | March 2023

April 28, 2023

Key Takeaways:

TSMC 3nm Capacity Expansion Plans:

  • TSMC is expected to continue transferring foundry capacities from 4/5nm to 3nm in Tainan Fab 18 due to slower wafer demand for the former and increased migration to the latter.
  • In anticipation of strong wafer demand in the coming years, particularly from major clients like Apple, Qualcomm, MediaTek, and AMD, TSMC's 3nm capacities are projected to reach 50-60K/m in Y2023 and 90-100K/m in Y2024.

 

TSMC Wafer Demand Forecast in Y2023:

  • TSMC's 6/7nm wafer demand is expected to decline by 36~40% YoY in Y2023 compared to Y2022 due to low visibility and momentum, resulting in sluggish recovery.

 

Intel's Arrow Lake Production Timeline:

  • The risk production timeline for Intel's Arrow Lake may be delayed due to unclear production plans for Intel 20A CPU tile and TSMC N3E GPU tile, which currently have low yield rates.

 

Qualcomm projects increase in PMIC demand for 5G smartphones:

  • Qualcomm expects to increase PMIC demand on 8-inch and 12-inch wafers by 4~7% and 1~2%, respectively, due to a growing market share of 5G smartphones.

 

Full insights delivered in Mar'23 Monthly Report.

The information we shared is only a short excerpt of our monthly report. If you have further interest in our research and findings, we would be happy to provide you with a more detailed and comprehensive report that includes additional insights and data points. Please contact us to access our full insights.

Authors

Lucy Chen

Lucy Chen, Vice President at Isaiah Research, has been working 25+ years in semiconductor industry. Focus on semiconductor engineering and supply chain research. Master in Application Chemistry, NCTU, Taiwan Currently as the Vice President at Isaiah Research and lead semiconductor research team to work on the supply chain analysis from IC design and IDM(Qualcomm, MediaTek, Intel, etc) to foundries(TSMC, Samsung, UMC, GlobalFoundries, SMIC) and OSATs(ASE,SPIL). Business development and customer management including raw materials and equipment suppliers, top tier foundries and smartphone brands. Used to work as the Engineering Director at Lam Research for 15+ years and Director of Technology & Marketing at SEZ Group. Focus on process engineering, product strategies planning, supply chain and customer management including foundries and memory.

  • TSMC
  • 3nm
  • Capacity Expansion
  • 4/5nm
  • Fab 18
  • Apple
  • Qualcomm
  • MediaTek
  • AMD
  • Wafer Demand
  • 6/7nm
  • Intel
  • Arrow Lake
  • Intel 20A
  • CPU
  • N3E
  • GPU
  • PMIC