Foundry Business and Market Trend Report | March 2023
April 28, 2023
Key Takeaways:
TSMC 3nm Capacity Expansion Plans:
- TSMC is expected to continue transferring foundry capacities from 4/5nm to 3nm in Tainan Fab 18 due to slower wafer demand for the former and increased migration to the latter.
- In anticipation of strong wafer demand in the coming years, particularly from major clients like Apple, Qualcomm, MediaTek, and AMD, TSMC's 3nm capacities are projected to reach 50-60K/m in Y2023 and 90-100K/m in Y2024.
TSMC Wafer Demand Forecast in Y2023:
- TSMC's 6/7nm wafer demand is expected to decline by 36~40% YoY in Y2023 compared to Y2022 due to low visibility and momentum, resulting in sluggish recovery.
Intel's Arrow Lake Production Timeline:
- The risk production timeline for Intel's Arrow Lake may be delayed due to unclear production plans for Intel 20A CPU tile and TSMC N3E GPU tile, which currently have low yield rates.
Qualcomm projects increase in PMIC demand for 5G smartphones:
- Qualcomm expects to increase PMIC demand on 8-inch and 12-inch wafers by 4~7% and 1~2%, respectively, due to a growing market share of 5G smartphones.
Full insights delivered in Mar'23 Monthly Report.
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